General IndustrialCompleted May 2021Chandler, AZ
Refrac Systems — Second Auction, Die Bond Equipment, Chandler, AZ
Second auction from Refrac Systems in Chandler, Arizona — additional die bond equipment, semiconductor assembly machinery, and electronics manufacturing assets from the ongoing facility liquidation.
Equipment Highlights
Additional Die Bonding MachinesWire Bonding EquipmentSemiconductor Assembly ToolsPrecision Electronics EquipmentTest and Measurement EquipmentFacility Support Assets
Outcome
Sale completed May 2021. Assets sold through KD Capital's national buyer network.
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